Invention Grant
- Patent Title: Sealed body and method for manufacturing the same
- Patent Title (中): 密封体及其制造方法
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Application No.: US14068694Application Date: 2013-10-31
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Publication No.: US09568776B2Publication Date: 2017-02-14
- Inventor: Daiki Nakamura , Yusuke Kubota , Yusuke Nishido
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2012-242828 20121102
- Main IPC: G02F1/1339
- IPC: G02F1/1339 ; H01L51/52 ; H01L27/32 ; G02F1/1345 ; G02F1/1333

Abstract:
A sealed body which is sealed with low-melting-point glass and has high airtightness is provided. In the sealed body, at least a wiring layer is provided between two facing substrates, the two substrates are bonded together with the use of a sealing layer containing glass frits as a material, and a metal layer is selectively provided in a region where the wiring layer and the sealing layer overlap. In a laser light irradiation step, the metal layer functions as a laser light reflecting film and suppresses application of excess energy to a sealing member in a region overlapping with the wiring layer.
Public/Granted literature
- US20140125935A1 Sealed Body and Method for Manufacturing the Same Public/Granted day:2014-05-08
Information query
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