Invention Grant
- Patent Title: Method and system for positioning wafer in semiconductor manufacturing fabrication
- Patent Title (中): 晶圆在半导体制造制造中的定位方法和系统
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Application No.: US14674120Application Date: 2015-03-31
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Publication No.: US09570334B2Publication Date: 2017-02-14
- Inventor: Yao-Yuan Shang , Kuo-Shu Tseng , Chune-Te Yang , Chi-Hsin Chan , Chung-Jhieh Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; G06T7/00 ; H01L21/67 ; H01L21/687 ; H01L21/02 ; H01L21/027 ; H01L21/66 ; H01L21/677
Abstract:
A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.
Public/Granted literature
- US20160293471A1 METHOD AND SYSTEM FOR POSITIONING WAFER IN SEMICONDUCTOR MANUFACTURING FABRICATION Public/Granted day:2016-10-06
Information query
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