公开(公告)号：US09570334B2

公开(公告)日：2017-02-14

申请号：US14674120

申请日：2015-03-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yao-Yuan Shang ,  Kuo-Shu Tseng ,  Chune-Te Yang ,  Chi-Hsin Chan ,  Chung-Jhieh Chen

IPC: H01L21/68 ,  G06T7/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  H01L21/027 ,  H01L21/66 ,  H01L21/677

CPC classification number: H01L21/681 ,  G03F7/162 ,  G03F7/168 ,  G06T7/74 ,  G06T2207/30148 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68707

Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.

Abstract translation: 提供了一种用于在半导体制造中定位晶片的方法。 该方法包括通过转移模块将晶片送入处理室。 该方法还包括通过监视模块产生相对于晶片边缘的视频图像。 该方法还包括对视频图像执行图像分析以确定晶片的边缘是否处于正确的位置。 如果晶片的边缘不在正确位置，则计算偏移值，并根据移动值移动晶片。