Invention Grant
US09570603B2 Semiconductor device having trench gate structure and method for manufacturing the semiconductor device
有权
具有沟槽栅极结构的半导体器件和用于制造半导体器件的方法
- Patent Title: Semiconductor device having trench gate structure and method for manufacturing the semiconductor device
- Patent Title (中): 具有沟槽栅极结构的半导体器件和用于制造半导体器件的方法
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Application No.: US14936666Application Date: 2015-11-09
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Publication No.: US09570603B2Publication Date: 2017-02-14
- Inventor: Hajime Okuda , Yasushi Hamazawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2014-228459 20141110
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L27/092 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/49 ; H01L29/10 ; H01L29/45

Abstract:
A semiconductor device of the present invention includes a semiconductor layer in which a gate trench is formed, a gate insulating film formed along an inner surface of the gate trench, a gate electrode that is buried in the gate trench through the gate insulating film and that has a lower electrode and an upper electrode that are separated upwardly and downwardly from each other with an intermediate insulating film between the lower electrode and the upper electrode, and a gate contact that is formed in the gate trench so as to pass through the upper electrode and through the intermediate insulating film and so as to reach the lower electrode and that electrically connects the lower electrode and the upper electrode together.
Public/Granted literature
- US20160133742A1 SEMICONDUCTOR DEVICE HAVING TRENCH GATE STRUCTURE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2016-05-12
Information query
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