Invention Grant
US09574959B2 Various stress free sensor packages using wafer level supporting die and air gap technique
有权
各种无压力传感器封装采用晶圆级支撑模和气隙技术
- Patent Title: Various stress free sensor packages using wafer level supporting die and air gap technique
- Patent Title (中): 各种无压力传感器封装采用晶圆级支撑模和气隙技术
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Application No.: US14517387Application Date: 2014-10-17
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Publication No.: US09574959B2Publication Date: 2017-02-21
- Inventor: Caleb C. Han , Tongbi Jiang , Jun Zhai
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/50 ; G01P15/12 ; G01P15/08 ; B81B7/00 ; G01L7/08 ; H01L41/113 ; H01L41/09
Abstract:
Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
Public/Granted literature
- US20160061677A1 VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DIE AND AIR GAP TECHNIQUE Public/Granted day:2016-03-03
Information query
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