Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14826174Application Date: 2015-08-13
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Publication No.: US09577043B2Publication Date: 2017-02-21
- Inventor: Jongryeol Yoo , Hyun Jung Lee , Sunjung Kim , Seung Hun Lee , Eunhye Choi
- Applicant: Jongryeol Yoo , Hyun Jung Lee , Sunjung Kim , Seung Hun Lee , Eunhye Choi
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2014-0136835 20141010
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/165 ; H01L29/78 ; H01L21/8238 ; H01L27/092 ; H01L27/088 ; H01L21/8234

Abstract:
A semiconductor device includes a buffer layer on a semiconductor substrate including first and second regions, a first channel layer on the buffer layer of the first region, a second channel layer on the buffer layer of the second region, and a spacer layer between the second channel layer and the buffer layer. The buffer layer, the first and second channel layers, and the spacer layer are formed of semiconductor materials including germanium. A germanium concentration difference between the first and second channel layers is greater than a germanium concentration difference between the buffer layer and the second channel layer. The spacer layer has a germanium concentration gradient.
Public/Granted literature
- US20160104775A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-04-14
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