Invention Grant
- Patent Title: Tungsten gates for non-planar transistors
- Patent Title (中): 用于非平面晶体管的钨栅极
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Application No.: US14860341Application Date: 2015-09-21
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Publication No.: US09580776B2Publication Date: 2017-02-28
- Inventor: Sameer S. Pradhan , Daniel B. Bergstrom , Jin-Sung Chun , Julia Chiu
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; C22C30/00 ; H01L29/45 ; H01L29/51 ; H01L29/49 ; H01L29/06 ; H01L21/8238 ; H01L27/092

Abstract:
The present description relates to the field of fabricating microelectronic devices having non-planar transistors. Embodiments of the present description relate to the formation of gates within non-planar NMOS transistors, wherein an NMOS work-function material, such as a composition of aluminum, titanium, and carbon, may be used in conjunction with a titanium-containing gate fill barrier to facilitate the use of a tungsten-containing conductive material in the formation of a gate electrode of the non-planar NMOS transistor gate.
Public/Granted literature
- US20160035725A1 TUNGSTEN GATES FOR NON-PLANAR TRANSISTORS Public/Granted day:2016-02-04
Information query
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