Invention Grant
- Patent Title: Method for operating semiconductor manufacturing equipment
- Patent Title (中): 半导体制造设备的运行方法
-
Application No.: US14600132Application Date: 2015-01-20
-
Publication No.: US09580800B2Publication Date: 2017-02-28
- Inventor: Byoung-Hoon Lee , June-Hee Lee , Geun-Woo Kim , Min-Woo Song , Seok-Jun Won
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2014-0026096 20140305
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66 ; C23C16/44 ; C23C16/32 ; C23C16/34 ; H01L21/67
Abstract:
A method for operating semiconductor manufacturing equipment is provided. The method includes forming a conductive thin film on an inner side surface of a reaction chamber and on a substrate in the reaction chamber, the conductive thin film including a first conductive material, and forming a particle preventive layer on the inner side surface of the reaction chamber in which the conductive thin film is formed.
Public/Granted literature
- US20150252470A1 METHOD FOR OPERATING SEMICONDUCTOR MANUFACTURING EQUIPMENT Public/Granted day:2015-09-10
Information query
