Invention Grant
US09583318B2 Plasma processing apparatus, plasma processing method, and recording medium
有权
等离子体处理装置,等离子体处理方法和记录介质
- Patent Title: Plasma processing apparatus, plasma processing method, and recording medium
- Patent Title (中): 等离子体处理装置,等离子体处理方法和记录介质
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Application No.: US15080822Application Date: 2016-03-25
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Publication No.: US09583318B2Publication Date: 2017-02-28
- Inventor: Shigehiro Miura , Takeshi Kobayashi , Katsuaki Sugawara , Naohide Ito
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2015-069570 20150330
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32 ; C23C16/458 ; C23C16/52 ; C23C16/50 ; H01L21/687

Abstract:
There is provided an apparatus of performing a plasma process on substrates mounted on an upper surface of a rotary table. The apparatus includes: a heater for heating the substrates; a process gas supply part for supplying a process gas toward the upper surface of the rotary table; an antenna for generating an inductively coupled plasma by converting the process gas to plasma; a light detection part for detecting respective light intensities of R, G and B component as light color components; a calculation part for obtaining an evaluation value corresponding to a change amount before and after supplying a high-frequency power to the antenna, with respect to at least one of the respective light intensities; and an ignition determination part for comparing the evaluation value with a threshold value and to determine that ignition of plasma is not generated if the evaluation value does not exceed the threshold value.
Public/Granted literature
- US20160293390A1 PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND RECORDING MEDIUM Public/Granted day:2016-10-06
Information query
IPC分类: