Invention Grant
- Patent Title: Inverted contact
- Patent Title (中): 反接触
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Application No.: US14083604Application Date: 2013-11-19
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Publication No.: US09583351B2Publication Date: 2017-02-28
- Inventor: Andy Wei
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams Morgan, P.C.
- Main IPC: H01L21/283
- IPC: H01L21/283 ; H01L29/417 ; H01L21/768

Abstract:
An inverted contact and methods of fabrication are provided. A sacrificial layer is patterned in an inverted trapezoid shape, and oxide is deposited around the pattern. The sacrificial layer is removed, and a metal contact material is deposited, taking an inverted-trapezoid shape. Embodiments of the present invention provide an inverted contact, having a wider base and a narrower top. The wider base provides improved electrical contact to the underlying active area. The narrower top allows for closer placement of adjacent contacts, serving to increase overall circuit density of an integrated circuit.
Public/Granted literature
- US20150137194A1 INVERTED CONTACT AND METHODS OF FABRICATION Public/Granted day:2015-05-21
Information query
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