Invention Grant
- Patent Title: Electronic device with solder pads including projections
- Patent Title (中): 带焊盘的电子设备包括突起
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Application No.: US14135209Application Date: 2013-12-19
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Publication No.: US09583470B2Publication Date: 2017-02-28
- Inventor: Omkar Karhade , Nitin Deshpande
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L25/18 ; H01L25/00 ; H01L23/00 ; H01L23/498
Abstract:
An electronic device including a solder pad structure and methods of forming an electrical interconnection are shown. Solder pads including one or more projections extending from the pads are shown where the projections occupy only a fraction of a surface area of the pads. Processes such as thermal compression bonding using solder pads as described are also shown.
Public/Granted literature
- US20150179622A1 SOLDER PAD DEVICE AND METHOD Public/Granted day:2015-06-25
Information query
IPC分类:
