发明授权
- 专利标题： Electronic device with solder pads including projections
- 专利标题（中）： 带焊盘的电子设备包括突起
-
申请号： US14135209申请日： 2013-12-19
-
公开(公告)号： US09583470B2公开(公告)日： 2017-02-28
- 发明人: Omkar Karhade , Nitin Deshpande
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L25/18 ; H01L25/00 ; H01L23/00 ; H01L23/498
摘要：
An electronic device including a solder pad structure and methods of forming an electrical interconnection are shown. Solder pads including one or more projections extending from the pads are shown where the projections occupy only a fraction of a surface area of the pads. Processes such as thermal compression bonding using solder pads as described are also shown.
公开/授权文献
- US20150179622A1 SOLDER PAD DEVICE AND METHOD 公开/授权日：2015-06-25
信息查询
IPC分类:
