Invention Grant
US09583590B2 Integrated circuit devices including FinFETs and methods of forming the same
有权
包括FinFET的集成电路器件及其形成方法
- Patent Title: Integrated circuit devices including FinFETs and methods of forming the same
- Patent Title (中): 包括FinFET的集成电路器件及其形成方法
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Application No.: US14698402Application Date: 2015-04-28
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Publication No.: US09583590B2Publication Date: 2017-02-28
- Inventor: Borna J. Obradovic , Robert C. Bowen , Mark S. Rodder
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/82 ; H01L21/8234 ; H01L21/8238 ; H01L21/308 ; H01L29/78 ; H01L29/165

Abstract:
Methods of forming a finFET are provided. The methods may include forming a fin-shaped channel region including indium (In) on a substrate, forming a deep source/drain region adjacent to the channel region on the substrate and forming a source/drain extension region between the channel region and the deep source/drain region. Opposing sidewalls of the source/drain extension region may contact the channel region and the deep source/drain region, respectively, and the source/drain extension region may include InyGa1−yAs, and y is in a range of about 0.3 to about 0.5.
Public/Granted literature
- US20150243756A1 INTEGRATED CIRCUIT DEVICES INCLUDING FINFETS AND METHODS OF FORMING THE SAME Public/Granted day:2015-08-27
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