Invention Grant
- Patent Title: Semiconductor device with improved short circuit capability
- Patent Title (中): 具有改善短路能力的半导体器件
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Application No.: US14500324Application Date: 2014-09-29
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Publication No.: US09583604B2Publication Date: 2017-02-28
- Inventor: Mikio Tsujiuchi , Tetsuya Nitta
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-216464 20131017
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L29/06 ; H01L29/10

Abstract:
A semiconductor device in which short circuit capability can be improved while decline in overall current capability is suppressed. In the semiconductor device, a plurality of IGBTs (insulated gate bipolar transistors) arranged in a row in one direction over the main surface of a semiconductor substrate include an IGBT located at an extreme end in the one direction and an IGBT located more centrally than the IGBT located at the extreme end. The current capability of the IGBT located at the extreme end is higher than the current capability of the IGBT located centrally.
Public/Granted literature
- US20150108541A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-04-23
Information query
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