Invention Grant
- Patent Title: Plane connected embedded substrate capacitor
- Patent Title (中): 平面连接嵌入式基板电容器
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Application No.: US14185505Application Date: 2014-02-20
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Publication No.: US09585242B2Publication Date: 2017-02-28
- Inventor: Ryan Michael Coutts , Yuancheng Christopher Pan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H01L23/498 ; H05K3/46 ; H01L23/64 ; H01L23/00
Abstract:
A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane.
Public/Granted literature
- US20150237714A1 PLANE CONNECTED EMBEDDED SUBSTRATE CAPACITOR Public/Granted day:2015-08-20
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