Invention Grant
- Patent Title: Assembly of an integrated circuit chip and of a plate
- Patent Title (中): 集成电路芯片和板的组装
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Application No.: US14857041Application Date: 2015-09-17
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Publication No.: US09589874B2Publication Date: 2017-03-07
- Inventor: Louis-Michel Collin , Luc Guy Frechette , Sandrine Lhostis
- Applicant: STMicroelectronics (Crolles 2) SAS , SOCPRA Sciences et Génie S.E.C.
- Applicant Address: FR Crolles CA Sherbrooke
- Assignee: STMicroelectronics (Crolles 2) SAS,SOCPRA Sciences et Génie S.E.C.
- Current Assignee: STMicroelectronics (Crolles 2) SAS,SOCPRA Sciences et Génie S.E.C.
- Current Assignee Address: FR Crolles CA Sherbrooke
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1462372 20141212
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495 ; H01L21/311 ; H01L21/48 ; H01L21/52 ; H01L21/54 ; H01L21/56 ; H01L23/31 ; H01L23/42 ; H01L23/492 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/473
Abstract:
An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
Public/Granted literature
- US20160172278A1 ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE Public/Granted day:2016-06-16
Information query
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