Invention Grant
- Patent Title: Semiconductor devices having gate structures and methods of manufacturing the same
- Patent Title (中): 具有栅极结构的半导体器件及其制造方法
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Application No.: US14859447Application Date: 2015-09-21
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Publication No.: US09590099B2Publication Date: 2017-03-07
- Inventor: Bin Liu , Sun-Min Kim , Shigenobu Maeda
- Applicant: Bin Liu , Sun-Min Kim , Shigenobu Maeda
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2014-0126891 20140923
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/161 ; H01L29/167 ; H01L29/423 ; H01L29/51 ; H01L29/786 ; H01L29/10 ; H01L29/06 ; H01L21/324

Abstract:
Semiconductor devices are provided including an active layer, a gate structure, a spacer, and a source/drain layer. The active layer is on the substrate and includes germanium. The active layer includes a first region having a first germanium concentration, and a second region on both sides of the first region. The second region has a top surface getting higher from a first portion of the second region adjacent to the first region toward a second portion of the second region far from the first region, and has a second germanium concentration less than the first germanium concentration. The gate structure is formed on the first region of the active layer. The spacer is formed on the second region of the active layer, and contacts a sidewall of the gate structure. The source/drain layer is adjacent to the second region of the active layer.
Public/Granted literature
- US20160087098A1 Semiconductor Devices Having Gate Structures and Methods of Manufacturing the Same Public/Granted day:2016-03-24
Information query
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