Invention Grant
- Patent Title: Contact terminal for printed circuit board
- Patent Title (中): 印刷电路板接触端子
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Application No.: US14309365Application Date: 2014-06-19
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Publication No.: US09590326B2Publication Date: 2017-03-07
- Inventor: Soon-Woong Yang , Young-Gyun Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongton-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongton-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2011-0090077 20110906
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/55 ; H01R12/58 ; H01R13/24

Abstract:
A contact terminal device for a Printed Circuit Board (PCB), includes the contact terminal being formed to correspondingly cover at least a portion of an opening formed in the PCB and a terminal member fixed onto the PCB, in which the terminal member includes a fixing portion fixed around the opening on a surface of the PCB and a contact terminal portion extending from the fixing portion to be disposed on the opening. The contact terminal for the PCB reduces a height from a surface of the PCB to a contact point with a counterpart component, i.e., a contact height, contributing to reducing the thickness of the portable terminal.
Public/Granted literature
- US20140302730A1 CONTACT TERMINAL FOR PRINTED CIRCUIT BOARD Public/Granted day:2014-10-09
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