Invention Grant
US09593007B2 Method of forming a micro-electro-mechanical system (MEMS) structure
有权
形成微机电系统(MEMS)结构的方法
- Patent Title: Method of forming a micro-electro-mechanical system (MEMS) structure
- Patent Title (中): 形成微机电系统(MEMS)结构的方法
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Application No.: US14519772Application Date: 2014-10-21
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Publication No.: US09593007B2Publication Date: 2017-03-14
- Inventor: Christopher V. Jahnes , Anthony K. Stamper
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Nathan M. Rau
- Main IPC: H04R31/00
- IPC: H04R31/00 ; B81B3/00 ; B81C1/00 ; G06F17/50 ; B81B7/00 ; H01L41/113 ; H01L41/09

Abstract:
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. A wiring layer is formed on a substrate comprising actuator electrodes and a contact electrode. A MEMS beam is formed above the wiring layer and at least one spring is formed and attached to at least one end of the MEMS beam. At least one spring has a predetermined spring constant based on a coefficient of thermal expansion (CTE) mismatch between materials of the MEMS structure and the spring. Additionally, an array of mini-bumps is formed between the wiring layer and the MEMS beam. A size of a space between fixed actuator electrodes or dummy actuators is determined based on a lateral shift of the MEMS beam.
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