Invention Grant
- Patent Title: Printed circuits with embedded strain gauges
- Patent Title (中): 带嵌入式应变片的印刷电路
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Application No.: US14812958Application Date: 2015-07-29
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Publication No.: US09593991B2Publication Date: 2017-03-14
- Inventor: Anne M. Mason , Bryan McDonald , Shawn X. Arnold , Matthew Casebolt , Dennis R. Pyper
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Michael H. Lyons
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01L3/14

Abstract:
A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.
Public/Granted literature
- US20170030784A1 Printed Circuits With Embedded Strain Gauges Public/Granted day:2017-02-02
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