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公开(公告)号：US10470307B2
公开(公告)日：2019-11-05
申请号：US16016610
申请日：2018-06-24
Applicant: Apple Inc.
Inventor： Dennis R. Pyper , Venkataram R. Raju , Yazan Z. Alnahhas
Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
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公开(公告)号：US20170030784A1
公开(公告)日：2017-02-02
申请号：US14812958
申请日：2015-07-29
Applicant: Apple Inc.
Inventor： Anne M. Mason , Bryan McDonald , Shawn X. Arnold , Matthew Casebolt , Dennis R. Pyper
IPC: G01L1/22
CPC classification number: G01L1/22 , G01L1/2262 , G01L1/2287 , G01L3/1457 , G01L5/0047 , G01M5/0033 , G01M5/0083
Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.
Abstract translation: 印刷电路板可以具有嵌入式应变计。 应变计可由聚合物基底上的金属迹线形成。 金属痕迹可以形成可变应变计电阻器，其被并入用于应变仪的桥式电路中。 印刷电路可以具有刚性印刷电路层，其具有容纳聚合物基底的凹部。 聚合物基板上的金属焊盘可以连接到可变应变计电阻器的相应末端。 具有凹槽的刚性印刷电路基板可以层压在附加的刚性印刷电路层之间。 可以通过附加的刚性印刷电路层形成通孔以接触金属焊盘。 当在电子设备中使用印刷电路或在测试期间使用印刷电路时，嵌入式应变计可用于收集应变数据。
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3.发明申请公开(公告)号：US20140134760A1
公开(公告)日：2014-05-15
申请号：US14162577
申请日：2014-01-23
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Dennis R. Pyper
CPC classification number: H01L22/10 , H01L23/48 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L23/58 , H01L24/32 , H01L24/73 , H01L24/80 , H01L24/82 , H01L29/84 , H01L2224/32225 , H01L2224/73267 , H01L2224/82105 , H01L2224/82138 , H05K1/00 , H05K1/0268 , H05K1/186 , H05K3/4611 , H05K2201/10674 , H05K2203/063
Abstract: Methods and devices for embedding semiconductors in printed circuit boards (PCBs) are provided. In one example, a method of manufacturing a PCB having a die assembly embedded therein includes removing a release film from an adhesive layer of the die assembly. The method also includes disposing the die assembly on a first layer of the PCB such that the adhesive layer contacts the first layer of the PCB. The method includes disposing a second layer of the PCB over the first layer such that the die assembly is within an intermediate portion between the first layer and the second layer. The method also includes filling the intermediate portion with resin and subjecting the PCB to a press cycle to cure the resin.
Abstract translation: 提供了在印刷电路板（PCB）中嵌入半导体的方法和装置。 在一个示例中，制造具有嵌入其中的模具组件的PCB的方法包括从模具组件的粘合剂层去除脱模膜。 该方法还包括将模具组件设置在PCB的第一层上，使得粘合剂层接触PCB的第一层。 该方法包括在第一层上布置PCB的第二层，使得模具组件位于第一层和第二层之间的中间部分内。 该方法还包括用树脂填充中间部分，并对PCB进行加压循环以固化树脂。
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公开(公告)号：US20140085850A1
公开(公告)日：2014-03-27
申请号：US13627989
申请日：2012-09-26
Applicant: Apple Inc.
Inventor： Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, JR. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC classification number: H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
Abstract translation: 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入件安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。
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公开(公告)号：US09593991B2
公开(公告)日：2017-03-14
申请号：US14812958
申请日：2015-07-29
Applicant: Apple Inc.
Inventor： Anne M. Mason , Bryan McDonald , Shawn X. Arnold , Matthew Casebolt , Dennis R. Pyper
CPC classification number: G01L1/22 , G01L1/2262 , G01L1/2287 , G01L3/1457 , G01L5/0047 , G01M5/0033 , G01M5/0083
Abstract: A printed circuit board may have embedded strain gauges. A strain gauge may be formed from a metal trace on a polymer substrate. The metal trace may form a variable strain gauge resistor that is incorporated into a bridge circuit for a strain gauge. The printed circuit may have a rigid printed circuit layer with a recess that receives the polymer substrate. Metal pads on the polymer substrate may be coupled to respective ends of the variable strain gauge resistor. The rigid printed circuit substrate with the recess may be laminated between additional rigid printed circuit layers. Vias may be formed through the additional rigid printed circuit layers to contact the metal pads. Embedded strain gauges may be used in gathering strain data when strain is imparted to a printed circuit during use of the printed circuit in an electronic device or during testing.
Abstract translation: 印刷电路板可以具有嵌入式应变计。 应变计可由聚合物基底上的金属迹线形成。 金属痕迹可以形成可变应变计电阻器，其被并入用于应变仪的桥式电路中。 印刷电路可以具有刚性印刷电路层，其具有容纳聚合物基底的凹部。 聚合物基板上的金属焊盘可以连接到可变应变计电阻器的相应末端。 具有凹槽的刚性印刷电路基板可以层压在附加的刚性印刷电路层之间。 可以通过附加的刚性印刷电路层形成通孔以接触金属焊盘。 当在电子设备中使用印刷电路或在测试期间使用印刷电路时，嵌入式应变计可用于收集应变数据。
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Patent Agency Ranking
公开(公告)号：US20140308465A1
公开(公告)日：2014-10-16
申请号：US13863264
申请日：2013-04-15
Applicant: APPLE INC.
Inventor： James R. Krogdahl , Benjamin J. Pope , Dennis R. Pyper , Nicholas G.L. Merz , Scott A. Myers
CPC classification number: H05K3/386 , C09J5/00 , C09J2201/606 , C09J2203/326 , C09J2205/31 , H05K3/323 , H05K3/361 , Y10T156/10 , Y10T428/13 , Y10T428/31678
Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.
Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。
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公开(公告)号：US20130120957A1
公开(公告)日：2013-05-16
申请号：US13631216
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Christopher Matthew Werner , Fletcher R. Rothkopf , Stephen Brian Lynch , Dennis R. Pyper , Wyeman Chen , Michael M. Nikkhoo , Amir Salehi
CPC classification number: H05K3/225 , H05K1/0216 , H05K9/0032 , H05K2201/1031 , H05K2201/10371 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144
Abstract: An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.
Abstract translation: 描述由RF不透明材料形成的RF屏蔽，其允许访问印刷电路板上的部件。 RF屏蔽件可以包括附接到PCB的第一部分和在界面处附接到第一部分的可移除顶部。 顶部从第一部分移除以露出PCB上的部件。 在所述实施例的一个方面，顶部从第一部分剥离。 在通过例如在接口处附接第一部分和另一顶部的激光器的激光附接和密封另一顶部到界面处的第一部分之后，将部件封装在RF屏蔽内。
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公开(公告)号：US20230026254A1
公开(公告)日：2023-01-26
申请号：US17381931
申请日：2021-07-21
Applicant: Apple Inc.
Inventor： Dennis R. Pyper , Leilei Zhang , Lan H. Hoang
IPC: H01L23/498 , H01L21/48 , H01L23/58
Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.
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公开(公告)号：US09992863B2
公开(公告)日：2018-06-05
申请号：US14466899
申请日：2014-08-22
Applicant: Apple Inc.
Inventor： Mahmoud R. Amini , Zheng Gao , Dennis R. Pyper
IPC: H05K7/00 , H05K1/02 , B23C3/12 , H01R13/66 , H01R24/60 , H05K3/06 , B23C5/04 , B23C5/12 , H01R13/6473 , H05K3/10 , H05K3/24 , H05K1/18 , H05K3/00
CPC classification number: H05K1/0296 , B23C3/12 , B23C5/04 , B23C5/12 , B23C2210/086 , B23C2210/088 , B23C2210/244 , B23C2220/16 , B23C2226/27 , H01R13/6473 , H01R13/6658 , H01R24/60 , H01R2201/06 , H05K1/0227 , H05K1/025 , H05K1/181 , H05K3/0044 , H05K3/06 , H05K3/10 , H05K3/108 , H05K3/243 , H05K3/244 , H05K2201/09027 , H05K2201/09081 , H05K2201/09154 , H05K2201/09354 , H05K2201/09445 , H05K2203/1469
Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.
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公开(公告)号：US09888307B2
公开(公告)日：2018-02-06
申请号：US15151445
申请日：2016-05-10
Applicant: Apple Inc.
Inventor： Nikolas T. Vitt , Neal D. Evans , Jesse A. Lippert , Ruchir M. Dave , Christopher Wilk , Brad G. Boozer , Dennis R. Pyper , Daniel K. Boothe
CPC classification number: H04R1/086 , H04R1/08 , H04R1/222 , H04R2499/11
Abstract: An electronic device having a microphone behind a water resistant, air-impermeable membrane is disclosed. Embodiments include a trapped volume of air between the membrane and the microphone. A barometric equalization element may define an acoustic leak path, e.g., a tortuous leak path, between the trapped volume of air and an encased space within a casing of the electronic device. Other embodiments are also described and claimed.
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