Invention Grant
- Patent Title: Circuit arrangement and method for manufacturing the same
- Patent Title (中): 电路布置及其制造方法
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Application No.: US13925900Application Date: 2013-06-25
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Publication No.: US09595487B2Publication Date: 2017-03-14
- Inventor: Ralf Otremba , Klaus Schiess , Anton Mauder
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/31 ; H01L23/40 ; H01L23/495 ; H05K1/02 ; H05K3/34

Abstract:
Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a plurality of discrete encapsulated integrated circuits arranged on the carrier; wherein a first integrated circuit of the plurality of integrated circuits is in electrical contact with a second integrated circuit of the plurality of integrated circuits to form a first current path bypassing the carrier; and wherein the first integrated circuit of the plurality of integrated circuits is in electrical contact with the second integrated circuit of the plurality of integrated circuits to form a second current path via the at least one electrically conductive line.
Public/Granted literature
- US20140374913A1 CIRCUIT ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-12-25
Information query
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