Invention Grant
- Patent Title: Field effect transistor and method of fabricating the same
- Patent Title (中): 场效应晶体管及其制造方法
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Application No.: US14723673Application Date: 2015-05-28
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Publication No.: US09595610B2Publication Date: 2017-03-14
- Inventor: TaeYong Kwon , Shigenobu Maeda , David Seo , Jae-Hwan Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello LLP
- Priority: KR10-2014-0084656 20140707
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/165 ; H01L29/08 ; H01L29/66

Abstract:
A MOSFET may be formed with a strain-inducing mismatch of lattice constants that improves carrier mobility. In exemplary embodiments a MOSFET includes a strain-inducing lattice constant mismatch that is not undermined by a recessing step. In some embodiments a source/drain pattern is grown without a recessing step, thereby avoiding problems associated with a recessing step. Alternatively, a recessing process may be performed in a way that does not expose top surfaces of a strain-relaxed buffer layer. A MOSFET device layer, such as a strain-relaxed buffer layer or a device isolation layer, is unaffected by a recessing step and, as a result, strain may be applied to a channel region without jeopardizing subsequent formation steps.
Public/Granted literature
- US20160005864A1 FIELD EFFECT TRANSISTOR AND METHOD OF FABRICATING THE SAME Public/Granted day:2016-01-07
Information query
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