Invention Grant
- Patent Title: Light emitting diode package and method for manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US14355373Application Date: 2013-04-26
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Publication No.: US09595638B2Publication Date: 2017-03-14
- Inventor: Hyung Soo Ahn , Min Yang , Kee Sam Shin , Sam Nyung Yi , Hyo Jong Lee , Moon Yeoung Yu
- Applicant: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- Applicant Address: KR Nam-Gu, Busan
- Assignee: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- Current Assignee: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
- Current Assignee Address: KR Nam-Gu, Busan
- Agency: Dilworth & Barrese, LLP.
- Agent Michael J. Musella
- Priority: KR10-2012-0045620 20120430
- International Application: PCT/KR2013/003604 WO 20130426
- International Announcement: WO2013/165124 WO 20131107
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/36 ; H01L33/62 ; H01L25/075 ; H01L33/00 ; H01L33/44
Abstract:
The present invention relates to a nitride light emitting diode (LED) package, and more specifically, to a nitride light emitting diode package which can improve light-emitting efficiency by increasing light emitting surface area, reduce operating voltage by simultaneously emitting light from six cells at once, and can increase operating current.
Public/Granted literature
- US20140306248A1 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-10-16
Information query
IPC分类:
