Invention Grant
US09596754B2 Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate
有权
干膜，使用其的印刷线路板，制造印刷线路板的方法和倒装芯片安装基板
- Patent Title: Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate
- Patent Title (中): 干膜，使用其的印刷线路板，制造印刷线路板的方法和倒装芯片安装基板
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Application No.: US14367611Application Date: 2012-12-18
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Publication No.: US09596754B2Publication Date: 2017-03-14
- Inventor: Gento Iwayama , Arata Endo , Shoji Minegishi , Masao Arima
- Applicant: TAIYO INK MFG. CO., LTD.
- Applicant Address: JP Hiki-gun
- Assignee: TAIYO INK MFG. CO., LTD.
- Current Assignee: TAIYO INK MFG. CO., LTD.
- Current Assignee Address: JP Hiki-gun
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-282019 20111222; JP2011-282020 20111222
- International Application: PCT/JP2012/082797 WO 20121218
- International Announcement: WO2013/094606 WO 20130627
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B32B7/02 ; B32B27/38 ; G06F7/00 ; H01L21/00 ; H05K1/03 ; H01L21/56 ; H05K3/28 ; H01L23/498 ; G03F7/40 ; H05K3/00 ; H05K3/46 ; B32B27/08 ; B32B27/16 ; B32B27/20 ; H05K3/34
Abstract:
A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.
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