Invention Grant
- Patent Title: Chip package including recess in side edge
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Application No.: US14618413Application Date: 2015-02-10
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Publication No.: US09601460B2Publication Date: 2017-03-21
- Inventor: Yen-Shih Ho , Tsang-Yu Liu , Chia-Sheng Lin , Chia-Ming Cheng , Shu-Ming Chang , Tzu-Wen Tseng
- Applicant: XINTEC INC.
- Applicant Address: TW Tauyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Tauyuan
- Agency: Liu & Liu
- Priority: TW103104366A 20140211
- Main IPC: H01L23/06
- IPC: H01L23/06 ; H01L23/00 ; H01L23/31 ; H01L29/06 ; H01L23/525
Abstract:
A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.
Public/Granted literature
- US20150228536A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2015-08-13
Information query
IPC分类:
