Invention Grant
- Patent Title: Antibody-binding peptide
-
Application No.: US14763589Application Date: 2013-12-25
-
Publication No.: US09605029B2Publication Date: 2017-03-28
- Inventor: Hideki Watanabe , Shinya Honda
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Applicant Address: JP Tokyo
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-013217 20130128
- International Application: PCT/JP2013/007583 WO 20131225
- International Announcement: WO2014/115229 WO 20140731
- Main IPC: C07K14/00
- IPC: C07K14/00 ; C07K7/06 ; C07K7/08 ; G01N33/68 ; C07K16/42
Abstract:
Polypeptides which have binding activity to an Fc region of immunoglobulin G and can be favorably used in detecting, purifying, immobilizing or removing an antibody, immunoglobulin G or a protein containing an Fc region of immunoglobulin G, are described. Methods for detecting, purifying, immobilizing or removing an antibody, immunoglobulin G or a protein containing an Fc region of immunoglobulin G, by using the peptide, are also described.
Public/Granted literature
- US20150353608A1 ANTIBODY-BINDING PEPTIDE Public/Granted day:2015-12-10
Information query
