Invention Grant
- Patent Title: Heat pump cycle
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Application No.: US14362310Application Date: 2012-12-03
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Publication No.: US09605883B2Publication Date: 2017-03-28
- Inventor: Yoshiki Katoh , Kota Sakamoto , Yuuichi Kami
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-266140 20111205; JP2012-250453 20121114
- International Application: PCT/JP2012/007736 WO 20121203
- International Announcement: WO2013/084463 WO 20130613
- Main IPC: F25B30/02
- IPC: F25B30/02 ; F28F9/26 ; F25B5/04 ; F25B6/04 ; F25B25/00 ; B60H1/00 ; F28F27/02 ; F28D1/04 ; F28D1/053 ; F28D7/00 ; F28D7/10 ; F25B6/00 ; F25B47/00 ; F25B47/02 ; F28F9/02 ; F28D21/00 ; F28F1/12

Abstract:
A heat pump cycle includes a refrigerant circuit and a coolant circuit. A first heat exchanger and a second heat exchanger are disposed between the refrigerant circuit and the coolant circuit. The first heat exchanger includes an exterior heat exchanger that functions as an evaporator in a heating operation, and a radiator for radiating heat of a coolant. The second heat exchanger transmits a heat of high-pressure refrigerant to the coolant in the heating operation. A temperature of refrigerant within the second heat exchanger is higher than a temperature of refrigerant within the first heat exchanger. The heat obtained from the second heat exchanger is supplied to the first heat exchanger through the coolant. Further, the heat obtained from the second heat exchanger is stored in the coolant. In defrosting operation, the coolant that has stored the heat therein is supplied to the first heat exchanger.
Public/Granted literature
- US20140318170A1 HEAT PUMP CYCLE Public/Granted day:2014-10-30
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