Invention Grant
- Patent Title: Method for bonding flat cable and bonding object, ultrasonic bonding device, and cable
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Application No.: US14803408Application Date: 2015-07-20
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Publication No.: US09607739B2Publication Date: 2017-03-28
- Inventor: Masahito Ozaki
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2014-155080 20140730; JP2014-155081 20140730
- Main IPC: B23K1/06
- IPC: B23K1/06 ; H01B13/06 ; H01B7/08 ; H01B13/00 ; B23K20/10 ; H01R43/02 ; B23K20/233 ; H01R4/02 ; B23K101/34 ; B23K101/38 ; B23K103/18

Abstract:
Provided is a method capable of reducing the amount of a coating part remaining between a conductor and a bonding object. A chip comes closer to an anvil so that the flat cable and the terminal are sandwiched between the chip and the anvil. The flat cable and the terminal are pressed so as to come close to each other. When the chip ultrasonically vibrates, vibrations of the chip propagate to the terminal, causing the terminal to ultrasonically vibrate. Then heat is generated in a plate part by friction between the chip and the plate part. The coating part being positioned between the conductor and the plate part melts from the generated heat and is removed. Thereby the conductor and the plate part come into contact with each other resulting in a solid-phase bonding together.
Public/Granted literature
- US20160035463A1 METHOD FOR BONDING FLAT CABLE AND BONDING OBJECT, ULTRASONIC BONDING DEVICE, AND CABLE Public/Granted day:2016-02-04
Information query
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