Invention Grant
- Patent Title: Optical package with recess in transparent cover
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Application No.: US13931313Application Date: 2013-06-28
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Publication No.: US09608029B2Publication Date: 2017-03-28
- Inventor: Wing Shenq Wong
- Applicant: STMicroelectronics Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD.
- Current Assignee: STMICROELECTRONICS PTE LTD.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group LLP
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L31/14 ; H01L21/00 ; H01L27/146
Abstract:
Embodiments of the present invention are directed to optical packages having a cover made of transparent material with a recess formed therein and methods of forming same. The recess may be formed in a periphery portion of the transparent material and may have various shapes and configurations. Adhesive is provided in at least a portion of the recess of the transparent material, which secures the transparent material to an image sensor.
Public/Granted literature
- US20150001111A1 OPTICAL PACKAGE WITH RECESS IN TRANSPARENT COVER Public/Granted day:2015-01-01
Information query
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