Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US14835373Application Date: 2015-08-25
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Publication No.: US09608108B2Publication Date: 2017-03-28
- Inventor: Mikio Tsujiuchi , Kouji Tanaka , Yasuki Yoshihisa , Shunji Kubo
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Koutou-ku, Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Koutou-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-173064 20140827
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/40 ; H01L29/417 ; H01L21/265 ; H01L29/06 ; H01L29/10

Abstract:
A semiconductor substrate has a main surface with an n type offset region having a trench portion formed of a plurality of trenches extending in a direction from an n+ drain region toward an n+ source region. The plurality of trenches each have a conducting layer therein extending in the main surface in the direction from the n+ drain region toward the n+ source region.
Public/Granted literature
- US20160064559A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-03-03
Information query
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