Invention Grant
- Patent Title: Chassis of electronic device
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Application No.: US14129597Application Date: 2013-09-27
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Publication No.: US09609765B2Publication Date: 2017-03-28
- Inventor: Xiaoguo Liang , Chung-Hao Chen , Alexander Uan-Zo-Li , Sheng Ren , Hong W. Wong
- Applicant: INTEL CORPORATION , Xiaoguo Liang , Chung-Hao Chen , Alexander Uan-Zo-Li , Sheng Ren , Hong W. Wong
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: KED & Associates LLP
- International Application: PCT/CN2013/084491 WO 20130927
- International Announcement: WO2015/042882 WO 20150402
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H04M1/02 ; H04B15/00 ; H01G4/30 ; H01G2/04 ; G06F1/18 ; G06F1/16 ; H04B15/02
Abstract:
A chassis for an electronic device may include a first metal layer to form an inner surface of the chassis, an insulating layer on the first metal layer, and a second metal layer on the insulating layer. The second metal layer may be connected to a ground area of a circuit board to be provided in the chassis.
Public/Granted literature
- US20150223351A1 CHASSIS OF ELECTRONIC DEVICE Public/Granted day:2015-08-06
Information query
