Invention Grant
- Patent Title: Solid precursor delivery system
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Application No.: US15099687Application Date: 2016-04-15
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Publication No.: US09611546B2Publication Date: 2017-04-04
- Inventor: Chung-Liang Cheng , Chien-Hao Tseng , Yen-Yu Chen , Ching-Chia Wu , Chang-Sheng Lee , Wei Zhang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L21/469
- IPC: H01L21/469 ; C23C16/44 ; H01L21/28 ; C23C16/448 ; C23C16/455 ; H01L29/51

Abstract:
A method for fabricating a semiconductor structure and a solid precursor delivery system for a semiconductor fabrication is provided, the method including: providing a solid precursor having a first average particle size; solving the solid precursor in an organic solvent into an intermediate; recrystallizing the intermediate to form solid granules, wherein the solid granules has a second average particle size larger than the first average particle size; vaporizing the solid granules to form a film-forming gas; and depositing the film-forming gas on a substrate to form a resistance film.
Public/Granted literature
- US20160230275A1 SOLID PRECURSOR DELIVERY SYSTEM Public/Granted day:2016-08-11
Information query
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