Invention Grant
- Patent Title: Printed circuits with sacrificial test structures
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Application No.: US14164769Application Date: 2014-01-27
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Publication No.: US09618564B2Publication Date: 2017-04-11
- Inventor: Sean A. Mayo , Shankar S. Pennathur
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: B05D1/02
- IPC: B05D1/02 ; B05D1/28 ; G01R31/28 ; H05K1/02 ; H05K1/14

Abstract:
Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.
Public/Granted literature
- US20150212114A1 Printed Circuits With Sacrificial Test Structures Public/Granted day:2015-07-30
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