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1.发明授权Vibration sensing system and method for categorizing portable device context and modifying device operations 有权用于分类便携式设备上下文和修改设备操作的振动感测系统和方法公开(公告)号：US09557843B2
公开(公告)日：2017-01-31
申请号：US14543391
申请日：2014-11-17
Applicant: Apple Inc.
Inventor： Ryan J. Garrone , Sean A. Mayo , Scott A. Mullin , Gordon C. Cameron
IPC: G06F3/041 , H04M1/72 , H04M1/725 , G06F3/0354
CPC classification number: G06F3/041 , G06F3/03545 , G06F3/0414 , G06F2203/04104 , G06F2203/04105 , G06F2203/04106 , H04M1/72563
Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.
Abstract translation: 这里公开了用于操作计算设备的方法，包括确定施加在计算设备的触敏表面上的压力的量。 根据各种实施例，触敏输入由触敏表面接收。 然后确定触摸输入对触敏表面施加的压力量。 当接收到第一压力量时，计算装置以第一方式操作，并且当接收到第二压力时以第二方式操作。
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公开(公告)号：US09743522B2
公开(公告)日：2017-08-22
申请号：US13627989
申请日：2012-09-26
Applicant: Apple Inc.
Inventor： Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, Jr. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC classification number: H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
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公开(公告)号：US20150194387A1
公开(公告)日：2015-07-09
申请号：US14146895
申请日：2014-01-03
Applicant: Apple Inc.
Inventor： Altan N. Yazar , Kiavash Baratzadeh , Michael J. Reilly , Sean A. Mayo
IPC: H01L23/552 , H05K1/02
CPC classification number: H01L23/552 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06562 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H05K1/0216 , H05K1/0218 , H05K1/0243 , H05K3/3436 , H05K9/0028 , H05K2201/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.
Abstract translation: 这是针对自屏蔽组件和制作相同的方法。 自屏蔽部件可以包括电磁干扰（EMI）屏蔽，其包含由EMI屏蔽限定的屏蔽空间内的电路。 可以通过将保形屏蔽层接合到设置在自屏蔽部件的基板上或内部的接地层来实现自屏蔽。 共形屏蔽层和周围层的组合可以形成包围需要屏蔽的电路的屏蔽空间的边界。 这使得自屏蔽部件能够安装到电路板，而不需要屏蔽罩或其它处理来施加EMI屏蔽。 此外，自屏蔽组件还包括EMI屏蔽的优点，同时降低了空间要求。
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公开(公告)号：US20140190930A1
公开(公告)日：2014-07-10
申请号：US13935250
申请日：2013-07-03
Applicant: Apple Inc.
Inventor： Sean A. Mayo , James H. Foster , Trevor J. Ness , Shankar S. Pennathur
IPC: H05K3/28
CPC classification number: H05K3/284 , H05K1/0209 , H05K3/288 , H05K2201/0108 , H05K2201/10106 , H05K2203/107 , H05K2203/1316 , H05K2203/1476
Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.
Abstract translation: 所描述的实施例一般涉及电子设备，更具体地涉及用于选择性地封装电子设备中包含的电路板和其它电子元件的方法。 第一封装层可以使用包括模制，激光烧蚀，蚀刻，研磨等在内的各种工艺限于电路板的特定区域。 然后可以在去除封装层的区域中进行二次组装步骤。 在一些实施例中，具有各种热，电和光特性的次级密封剂可以填充留在第一封装层中的开口以帮助底层部件的操作。
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公开(公告)号：US09455228B2
公开(公告)日：2016-09-27
申请号：US14146895
申请日：2014-01-03
Applicant: Apple Inc.
Inventor： Altan N. Yazar , Kiavash Baratzadeh , Michael J. Reilly , Sean A. Mayo
IPC: H05K9/00 , H01L23/552 , H05K1/02 , H05K3/34 , H01L23/00
CPC classification number: H01L23/552 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06562 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H05K1/0216 , H05K1/0218 , H05K1/0243 , H05K3/3436 , H05K9/0028 , H05K2201/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.
Abstract translation: 这是针对自屏蔽组件和制作相同的方法。 自屏蔽部件可以包括电磁干扰（EMI）屏蔽，其包含由EMI屏蔽限定的屏蔽空间内的电路。 可以通过将保形屏蔽层与设置在自屏蔽部件的基板上或内部的接地层相接合来实现自屏蔽。 共形屏蔽层和周围层的组合可以形成包围需要屏蔽的电路的屏蔽空间的边界。 这使得自屏蔽部件能够安装到电路板，而不需要屏蔽罩或其它处理来施加EMI屏蔽。 此外，自屏蔽组件还包括EMI屏蔽的优点，同时降低了空间要求。
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Patent Agency Ranking
公开(公告)号：US20140085850A1
公开(公告)日：2014-03-27
申请号：US13627989
申请日：2012-09-26
Applicant: Apple Inc.
Inventor： Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, JR. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC classification number: H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
Abstract translation: 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入件安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。
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7.发明申请公开(公告)号：US20170131805A1
公开(公告)日：2017-05-11
申请号：US15412986
申请日：2017-01-23
Applicant: Apple Inc.
Inventor： Ryan J. Garrone , Sean A. Mayo , Scott A. Mullin , Gordon C. Cameron
IPC: G06F3/041 , G06F3/0354
CPC classification number: G06F3/041 , G06F3/03545 , G06F3/0414 , G06F2203/04104 , G06F2203/04105 , G06F2203/04106 , H04M1/72563
Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.
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8.发明申请Vibration Sensing System and Method for Categorizing Portable Device Context and Modifying Device Operations 审中-公开振动传感系统及便携式设备分类方法及修改设备操作公开(公告)号：US20150070290A1
公开(公告)日：2015-03-12
申请号：US14543391
申请日：2014-11-17
Applicant: Apple Inc.
Inventor： Ryan J. Garrone , Sean A. Mayo , Scott A. Mullin , Gordon C. Cameron
IPC: G06F3/041 , G06F3/0354
CPC classification number: G06F3/041 , G06F3/03545 , G06F3/0414 , G06F2203/04104 , G06F2203/04105 , G06F2203/04106 , H04M1/72563
Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.
Abstract translation: 这里公开了用于操作计算设备的方法，包括确定施加在计算设备的触敏表面上的压力的量。 根据各种实施例，触敏输入由触敏表面接收。 然后确定触摸输入对触敏表面施加的压力量。 当接收到第一压力量时，计算装置以第一方式操作，并且当接收到第二压力时以第二方式操作。
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9.发明申请公开(公告)号：US20190033998A1
公开(公告)日：2019-01-31
申请号：US16144968
申请日：2018-09-27
Applicant: Apple Inc.
Inventor： Ryan J. Garrone , Sean A. Mayo , Scott A. Mullin , Gordon C. Cameron
IPC: G06F3/041 , H04M1/725 , G06F3/0354
Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.
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10.发明授权公开(公告)号：US10120469B2
公开(公告)日：2018-11-06
申请号：US15412986
申请日：2017-01-23
Applicant: Apple Inc.
Inventor： Ryan J. Garrone , Sean A. Mayo , Scott A. Mullin , Gordon C. Cameron
IPC: G06F3/041 , H04M1/72 , G06F3/0354 , H04M1/725
Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.
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