- Patent Title: Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device
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Application No.: US14783339Application Date: 2014-04-03
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Publication No.: US09620403B2Publication Date: 2017-04-11
- Inventor: Goji Shiga , Naohide Takamoto
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-081402 20130409
- International Application: PCT/JP2014/059875 WO 20140403
- International Announcement: WO2014/168074 WO 20141016
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L21/683 ; C09J133/04 ; H01L23/544 ; C09J7/02 ; C08K3/36 ; C09J133/08 ; H01L23/00 ; C08K3/00 ; C08K7/18
Abstract:
The present invention provides an adhesive sheet used in manufacture of a semiconductor device, containing a filler having an average particle size of 0.3 μm or less and an acrylic resin, wherein the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.
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