Invention Grant
- Patent Title: Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor
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Application No.: US14139457Application Date: 2013-12-23
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Publication No.: US09632411B2Publication Date: 2017-04-25
- Inventor: Timothy Michaelson , Timothy W. Weidman , Barry Lee Chin , Majeed Foad , Paul Deaton
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: G03C5/00
- IPC: G03C5/00 ; G03F7/00 ; G03F7/16 ; G03F7/09 ; G03F7/20

Abstract:
A photoresist vapor deposition system includes: a vacuum chamber having a heating element and cooled chuck for holding a substrate, the vacuum chamber having a heated inlet; and a vapor deposition system connected to the heated inlet for volatilizing a precursor into the vacuum chamber for condensing a photoresist over the substrate cooled by the cooled chuck. The deposition system creates a semiconductor wafer system that includes: a semiconductor wafer; and a vapor deposited photoresist over the semiconductor wafer. An extreme ultraviolet lithography system requiring the semiconductor wafer system includes: an extreme ultraviolet light source; a mirror for directing light from the extreme ultraviolet light source; a reticle stage for imaging the light from the extreme ultraviolet light source; and a wafer stage for placing a semiconductor wafer with a vapor deposited photoresist.
Public/Granted literature
- US20140268082A1 VAPOR DEPOSITION DEPOSITED PHOTORESIST, AND MANUFACTURING AND LITHOGRAPHY SYSTEMS THEREFOR Public/Granted day:2014-09-18
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