- 专利标题: System and method for modeling through silicon via
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申请号: US13419959申请日: 2012-03-14
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公开(公告)号: US09633149B2公开(公告)日: 2017-04-25
- 发明人: Hsiao-Tsung Yen , Yu-Ling Lin , Chin-Wei Kuo
- 申请人: Hsiao-Tsung Yen , Yu-Ling Lin , Chin-Wei Kuo
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Duane Morris LLP
- 主分类号: G06F9/455
- IPC分类号: G06F9/455 ; G06F17/50 ; H01L23/498
摘要:
A computer implemented system comprises a processor programmed to analyze a circuit to determine a response of the circuit to an input radio frequency (RF) signal, for at least one of designing, manufacturing, and testing the circuit. An interposer model is tangibly embodied in a non-transitory machine readable storage medium to be accessed by the processor. The interposer model is processed by the computer to output data representing a response of a though substrate via (TSV) to the radio frequency (RF) signal. The interposer model comprises a plurality of TSV models. Each TSV model has a respective three-port network. One of the ports of each three-port network is a floating node. The floating nodes of each of the three-port networks are connected to each other.
公开/授权文献
- US20130246990A1 SYSTEM AND METHOD FOR MODELING THROUGH SILICON VIA 公开/授权日:2013-09-19
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