Invention Grant
- Patent Title: Methods of providing dielectric to conductor adhesion in package structures
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Application No.: US14830681Application Date: 2015-08-19
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Publication No.: US09633837B2Publication Date: 2017-04-25
- Inventor: Vinodhkumar Raghunathan , Ebrahim Andideh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L21/02 ; H01L21/768 ; H01L23/498 ; H01L21/48 ; H01L23/538
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a CVD dielectric material on a package dielectric material, and then forming a conductive material on the CVD dielectric material.
Public/Granted literature
- US20150357185A1 METHODS OF PROVIDING DIELECTRIC TO CONDUCTOR ADHESION IN PACKAGE STRUCTURES Public/Granted day:2015-12-10
Information query
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