- Patent Title: System in package fan out stacking architecture and process flow
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Application No.: US14638925Application Date: 2015-03-04
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Publication No.: US09633974B2Publication Date: 2017-04-25
- Inventor: Jun Zhai , Kunzhong Hu , Kwan-Yu Lai , Mengzhi Pang , Chonghua Zhong , Se Young Yang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L21/56 ; H01L23/538 ; H01L23/00
Abstract:
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.
Public/Granted literature
- US20160260684A1 SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW Public/Granted day:2016-09-08
Information query
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