Invention Grant
- Patent Title: Integration of a replica circuit and a transformer above a dielectric substrate
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Application No.: US13829784Application Date: 2013-03-14
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Publication No.: US09634645B2Publication Date: 2017-04-25
- Inventor: Je-Hsiung Lan , Chi Shun Lo , Jonghae Kim , Mario Francisco Velez , John H. Hong
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H03H11/28
- IPC: H03H11/28 ; H01L23/522 ; H01L27/13 ; H01L49/02 ; H01L23/64 ; H01L27/12 ; H01L23/66 ; H01F19/08 ; H01F27/28
Abstract:
A particular device includes a replica circuit disposed above a dielectric substrate. The replica circuit includes a thin film transistor (TFT) configured to function as a variable capacitor or a variable resistor. The device further includes a transformer disposed above the dielectric substrate and coupled to the replica circuit. The transformer is configured facilitate an impedance match between the replica circuit and an antenna.
Public/Granted literature
- US20140266494A1 INTEGRATION OF A REPLICA CIRCUIT AND A TRANSFORMER ABOVE A DIELECTRIC SUBSTRATE Public/Granted day:2014-09-18
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