Invention Grant
- Patent Title: Integrated circuits and methods for their fabrication
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Application No.: US14813254Application Date: 2015-07-30
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Publication No.: US09640423B2Publication Date: 2017-05-02
- Inventor: Bharat Krishnan , Shishir Ray , Jinping Liu
- Applicant: GLOBALFOUNDRIES, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Lorenz & Kopf, LLP
- Main IPC: H01L21/763
- IPC: H01L21/763 ; H01L21/764 ; H01L29/06 ; H01L21/02 ; H01L21/768 ; H01L21/762 ; H01L29/78 ; H01L29/66
Abstract:
Integrated circuits and methods for producing the same are provided. In accordance with one embodiment a method of producing an integrated circuit includes forming a trench defined by a first material. The trench is filled with a second material to produce a gap defined within the second material, where the second material is in a solid state. The second material is reflowed within the trench to reduce a volume of the gap, and the second material is then solidified within the trench.
Public/Granted literature
- US20170033178A1 INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION Public/Granted day:2017-02-02
Information query
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