Invention Grant
- Patent Title: Image sensor circuit, system, and method
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Application No.: US13029665Application Date: 2011-02-17
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Publication No.: US09640574B2Publication Date: 2017-05-02
- Inventor: Jing-En Luan , Junyong Chen
- Applicant: Jing-En Luan , Junyong Chen
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE. LTD.
- Current Assignee: STMICROELECTRONICS PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/225

Abstract:
A process of forming optical sensors includes sealing an imaging portion of each of a plurality of optical sensors on a sensor wafer with a transparent material. The operation of sealing leaves a bonding portion of each of the optical sensors exposed. The process further includes cutting the wafer into a plurality of image sensor dies after sealing the optical sensors such that each image sensor die includes one of the optical sensors sealed with a corresponding portion of the transparent material.
Public/Granted literature
- US20120168888A1 IMAGE SENSOR CIRCUIT, SYSTEM, AND METHOD Public/Granted day:2012-07-05
Information query
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