Invention Grant
- Patent Title: Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure
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Application No.: US14958623Application Date: 2015-12-03
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Publication No.: US09646914B2Publication Date: 2017-05-09
- Inventor: Pierre Bar , Perceval Coudrain
- Applicant: STMicroelectronics SA
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1554475 20150519
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/373 ; H01L21/48 ; H01L23/498 ; H01L23/473 ; H01L23/48 ; H01L25/065 ; H01L25/00
Abstract:
A three-dimensional integrated structure includes a first and a second element each having an interconnection part formed by metallization levels encased in an insulating region. The first and second elements are attached to one another by the respective interconnection parts. The first element includes an electrical connection via passing through a substrate. A thermal cooling system includes at least one cavity having a first part located in the insulating region of the interconnection part of the first element and a second part located in the insulating region of the interconnection part of the second element and at least one through channel extending from a rear face of the first element to open into the at least one cavity.
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Information query
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