公开(公告)号：US20180142923A1

公开(公告)日：2018-05-24

申请号：US15801505

申请日：2017-11-02

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA

Inventor： Rafael Augusto Prieto Herrera ,  Jean-Philippe Colonna ,  Perceval Coudrain

IPC: F25B15/00 ,  F28F3/00 ,  H05K7/20

Abstract: A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.

公开(公告)号：US20180005889A1

公开(公告)日：2018-01-04

申请号：US15632878

申请日：2017-06-26

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Didier Campos ,  Benoit Besancon ,  Perceval Coudrain ,  Jean-Philippe Colonna

IPC: H01L21/78 ,  H01L23/373 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/29 ,  H01L21/782

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/782 ,  H01L23/29 ,  H01L23/36 ,  H01L23/373 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.

公开(公告)号：US20170287806A1

公开(公告)日：2017-10-05

申请号：US15451862

申请日：2017-03-07

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Rafael Augusto Prieto Herrera ,  Jean-Philippe Colonna ,  Perceval Coudrain

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/3672 ,  H01L23/3185 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/1816 ,  H01L2924/18161 ,  H01L2224/81

Abstract: An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.

公开(公告)号：US09997431B2

公开(公告)日：2018-06-12

申请号：US15451862

申请日：2017-03-07

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Rafael Augusto Prieto Herrera ,  Jean-Philippe Colonna ,  Perceval Coudrain

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L23/433

CPC classification number: H01L23/3672 ,  H01L23/3185 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/1816 ,  H01L2924/18161 ,  H01L2224/81

Abstract: An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.

公开(公告)号：US09870947B1

公开(公告)日：2018-01-16

申请号：US15632878

申请日：2017-06-26

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics SA ,  Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Didier Campos ,  Benoit Besancon ,  Perceval Coudrain ,  Jean-Philippe Colonna

IPC: H01L23/29 ,  H01L21/78 ,  H01L21/56 ,  H01L23/373 ,  H01L23/00 ,  H01L21/782 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/782 ,  H01L23/29 ,  H01L23/36 ,  H01L23/373 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.

公开(公告)号：US10480833B2

公开(公告)日：2019-11-19

申请号：US15801505

申请日：2017-11-02

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics SA

Inventor： Rafael Augusto Prieto Herrera ,  Jean-Philippe Colonna ,  Perceval Coudrain

IPC: F25B15/00 ,  F28F3/00 ,  H05K7/20 ,  G06F1/20 ,  H01L23/498 ,  H01L23/427 ,  H01L23/433

Abstract: A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.

公开(公告)号：US09224708B2

公开(公告)日：2015-12-29

申请号：US14339630

申请日：2014-07-24

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  STMICROELECTRONICS SA

Inventor： Jean-Philippe Colonna ,  Perceval Coudrain

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768 ,  H01L21/306 ,  H01L21/48 ,  H01L23/31 ,  H01L21/683

CPC classification number: H01L24/19 ,  H01L21/30604 ,  H01L21/4853 ,  H01L21/6836 ,  H01L21/7685 ,  H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/20 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13009 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/13171 ,  H01L2224/13181 ,  H01L2224/13186 ,  H01L2224/1356 ,  H01L2224/13565 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2224/13681 ,  H01L2224/13686 ,  H01L2224/14181 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a method for producing an interconnection pad on a conducting element comprising an upper face and a side wall; the method being executed from a substrate at least the upper face of which is insulating; the conducting element going through at least an insulating portion of the substrate, the method being characterized in that it comprises the sequence of the following steps: a step of embossing the conducting element, a step of forming, above the upper insulating face of the substrate, a stack of layers comprising at least one electrically conducting layer and one electrically resistive layer, a step of partially removing the electrically resistive layer, a step of electrolytic growth on the portion of the electrically conducting layer so as to form at least one interconnection pad on said conducting element.

Abstract translation: 本发明涉及一种用于在导电元件上制造互连焊盘的方法，包括上表面和侧壁; 所述方法从至少其上表面绝缘的衬底执行; 所述导电元件至少穿过所述基板的绝缘部分，所述方法的特征在于，其包括以下步骤的顺序：对所述导电元件进行压花的步骤，在所述基板的上绝缘面上方形成步骤 ，包括至少一个导电层和一个电阻层的层叠层，部分去除所述电阻层的步骤，在所述导电层的所述部分上的电解生长步骤，以便形成至少一个互连衬垫 在所述导电元件上。

公开(公告)号：US09646914B2

公开(公告)日：2017-05-09

申请号：US14958623

申请日：2015-12-03

Applicant: STMicroelectronics SA

Inventor： Pierre Bar ,  Perceval Coudrain

IPC: H01L23/52 ,  H01L23/373 ,  H01L21/48 ,  H01L23/498 ,  H01L23/473 ,  H01L23/48 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/373 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/76898 ,  H01L23/473 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589

Abstract: A three-dimensional integrated structure includes a first and a second element each having an interconnection part formed by metallization levels encased in an insulating region. The first and second elements are attached to one another by the respective interconnection parts. The first element includes an electrical connection via passing through a substrate. A thermal cooling system includes at least one cavity having a first part located in the insulating region of the interconnection part of the first element and a second part located in the insulating region of the interconnection part of the second element and at least one through channel extending from a rear face of the first element to open into the at least one cavity.

公开(公告)号：US20160343638A1

公开(公告)日：2016-11-24

申请号：US14958623

申请日：2015-12-03

Applicant: STMicroelectronics SA

Inventor： Pierre Bar ,  Perceval Coudrain

IPC: H01L23/373 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/373 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/76898 ,  H01L23/473 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589

Abstract: A three-dimensional integrated structure includes a first and a second element each having an interconnection part formed by metallization levels encased in an insulating region. The first and second elements are attached to one another by the respective interconnection parts. The first element includes an electrical connection via passing through a substrate. A thermal cooling system includes at least one cavity having a first part located in the insulating region of the interconnection part of the first element and a second part located in the insulating region of the interconnection part of the second element and at least one through channel extending from a rear face of the first element to open into the at least one cavity.

Abstract translation: 三维集成结构包括第一和第二元件，每个元件具有通过金属化等级封装在绝缘区域中形成的互连部件。 第一和第二元件通过相应的互连部件彼此附接。 第一元件包括通过基板的电连接。 热冷却系统包括至少一个腔，其具有位于第一元件的互连部分的绝缘区域中的第一部分和位于第二元件的互连部分的绝缘区域中的第二部分，以及至少一个贯穿通道 从第一元件的后表面开始进入至少一个空腔。