Invention Grant
- Patent Title: Surface mount microwave system including a transition between a multilayer arrangement and a hollow waveguide
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Application No.: US14335602Application Date: 2014-07-18
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Publication No.: US09647313B2Publication Date: 2017-05-09
- Inventor: Franco Marconi , Fabio Morgia , Haiou Gou , Stefano Verzura , Guoyu Su
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: EP12151801 20120119
- Main IPC: H01P5/107
- IPC: H01P5/107 ; H01Q9/04 ; H01P3/08 ; H01P3/12

Abstract:
The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.
Public/Granted literature
- US20140327490A1 SURFACE MOUNT MICROWAVE SYSTEM Public/Granted day:2014-11-06
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