公开(公告)号：US09647313B2

公开(公告)日：2017-05-09

申请号：US14335602

申请日：2014-07-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Franco Marconi ,  Fabio Morgia ,  Haiou Gou ,  Stefano Verzura ,  Guoyu Su

IPC: H01P5/107 ,  H01Q9/04 ,  H01P3/08 ,  H01P3/12

CPC classification number: H01P5/107 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P3/081 ,  H01P3/121 ,  H01Q9/0407 ,  H01L2924/00014

Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.