公开(公告)号：US09647313B2

公开(公告)日：2017-05-09

申请号：US14335602

申请日：2014-07-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Franco Marconi ,  Fabio Morgia ,  Haiou Gou ,  Stefano Verzura ,  Guoyu Su

IPC: H01P5/107 ,  H01Q9/04 ,  H01P3/08 ,  H01P3/12

CPC classification number: H01P5/107 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01P3/081 ,  H01P3/121 ,  H01Q9/0407 ,  H01L2924/00014

Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.

公开(公告)号：US09893433B2

公开(公告)日：2018-02-13

申请号：US15178646

申请日：2016-06-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chang Cao ,  Fabio Morgia ,  Uhland Goebel ,  Guoyu Su

IPC: H01Q13/10 ,  H01Q21/00 ,  H01Q13/18 ,  H01P5/12 ,  H01Q21/06

CPC classification number: H01Q21/0043 ,  H01P5/12 ,  H01Q13/18 ,  H01Q21/0006 ,  H01Q21/005 ,  H01Q21/0093 ,  H01Q21/064

Abstract: The present disclosure provides an array antenna. The array antenna includes a cavity power divider that receives an input signal and performs power division to output a first power-divided signal. The array antenna also includes a final-stage power dividing, coupling, and radiating unit that includes a dielectric substrate and a first and a second metal surface layer. A coupling slot array is formed on the second metal surface layer to receive the first power-divided signal. A radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; Several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot.

公开(公告)号：US20160301143A1

公开(公告)日：2016-10-13

申请号：US15178646

申请日：2016-06-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chang Cao ,  Fabio Morgia ,  Uhland Goebel ,  Guoyu Su

IPC: H01Q21/00

CPC classification number: H01Q21/0043 ,  H01P5/12 ,  H01Q13/18 ,  H01Q21/0006 ,  H01Q21/005 ,  H01Q21/0093 ,  H01Q21/064

Abstract: The present disclosure provides an array antenna. The array antenna includes a cavity power divider that receives an input signal and performs power division to output a first power-divided signal. The array antenna also includes a final-stage power dividing, coupling, and radiating unit that includes a dielectric substrate and a first and a second metal surface layer. A coupling slot array is formed on the second metal surface layer to receive the first power-divided signal. A radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; Several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot.

Abstract translation: 本公开提供了阵列天线。 阵列天线包括腔功率分配器，其接收输入信号并执行功率分配以输出第一分频信号。 阵列天线还包括最终级功率分配，耦合和辐射单元，其包括电介质基底和第一和第二金属表面层。 耦合槽阵列形成在第二金属表面层上以接收第一分配信号。 在所述第一金属表面层上形成对应于所述耦合槽阵列的辐射槽阵列; 在电介质基板上设置有多个电镀通孔单元，其中电镀通孔单元垂直穿过第一和第二金属表面层，并且与每个电镀通孔单元相对应的范围包围耦合槽和辐射槽 对应于联接槽。