Invention Grant
- Patent Title: Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
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Application No.: US14585724Application Date: 2014-12-30
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Publication No.: US09647329B2Publication Date: 2017-05-09
- Inventor: Juan Alejandro Herbsommer , Matthew David Romig
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent John R. Pessetto; Charles A. Brill; Frank D. Cimino
- Main IPC: H01Q1/50
- IPC: H01Q1/50 ; H01Q1/40 ; H01L23/66 ; H01L23/00 ; H01L21/56 ; H01L21/78 ; H01Q19/10 ; H01L23/495 ; H01L23/31
Abstract:
An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC.
Public/Granted literature
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