SUBSTRATE-INTEGRATED WAVEGUIDE
    1.
    发明公开

    公开(公告)号:US20230352315A1

    公开(公告)日:2023-11-02

    申请号:US17733921

    申请日:2022-04-29

    摘要: One example includes a method for fabricating a substrate-integrated waveguide (SIW). The method includes forming a first metal layer on a carrier surface. The first metal layer can extend along an axis. The method also includes forming a first metal sidewall extending from a first edge of the first metal layer along the axis and forming a second metal sidewall extending from a second edge of the first metal layer opposite the first edge along the axis to form a trough extending along the axis. The method also includes providing a dielectric material over the first metal layer and over the first and second metal sidewalls. The method further includes forming a second metal layer over the dielectric material and over the first and second metal sidewalls. The second metal layer can extend along the axis to enclose the SIW in all radial directions along the axis.

    Hermetic vial for quantum transitions detection in electronic devices applications

    公开(公告)号:US11782392B2

    公开(公告)日:2023-10-10

    申请号:US17491284

    申请日:2021-09-30

    IPC分类号: G04F5/14 H01S1/06 H03L7/26

    CPC分类号: G04F5/145 H01S1/06 H03L7/26

    摘要: A physics cell includes a sealed glass vial that contains a high-purity dipolar gas (e.g., OCS) at a low pressure (e.g., between about 0.01 millibar and 0.2 millibar). The vial can be sealed using a laser cutting process that involves only local heating of the vial that does not denature the bulk of the contained gas. One or more electromagnetically translucent windows or vial-end access points provide access to electromagnetic waves launched or received by one or more electromagnetic antennas at a frequency that is adjusted to match the quantum transition frequency of the gas based on a detected maximum absorption frequency. The glass-vial physics cell can be fabricated at lower cost than physics cells fabricated from bonded wafers. Multiple vials can be joined by a waveguide in an enclosure so that launch and receive antennas can be provided at a single end of the vials.

    MICROELECTRONIC DEVICE PACKAGE WITH INTEGRATED ANTENNA

    公开(公告)号:US20230134737A1

    公开(公告)日:2023-05-04

    申请号:US17515315

    申请日:2021-10-29

    摘要: A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.

    PACKAGE FOR MILLIMETER WAVE MOLECULAR CLOCK

    公开(公告)号:US20220209779A1

    公开(公告)日:2022-06-30

    申请号:US17246300

    申请日:2021-04-30

    摘要: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

    HERMETIC VIAL FOR QUANTUM TRANSITIONS DETECTION IN ELECTRONIC DEVICES APPLICATIONS

    公开(公告)号:US20220107609A1

    公开(公告)日:2022-04-07

    申请号:US17491284

    申请日:2021-09-30

    IPC分类号: G04F5/14 H03L7/26 H01S1/06

    摘要: A physics cell includes a sealed glass vial that contains a high-purity dipolar gas (e.g., OCS) at a low pressure (e.g., between about 0.01 millibar and 0.2 millibar). The vial can be sealed using a laser cutting process that involves only local heating of the vial that does not denature the bulk of the contained gas. One or more electromagnetically translucent windows or vial-end access points provide access to electromagnetic waves launched or received by one or more electromagnetic antennas at a frequency that is adjusted to match the quantum transition frequency of the gas based on a detected maximum absorption frequency. The glass-vial physics cell can be fabricated at lower cost than physics cells fabricated from bonded wafers. Multiple vials can be joined by a waveguide in an enclosure so that launch and receive antennas can be provided at a single end of the vials.