Invention Grant
- Patent Title: Multi-layer interconnected spiral capacitor
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Application No.: US14625484Application Date: 2015-02-18
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Publication No.: US09653533B2Publication Date: 2017-05-16
- Inventor: Uei-Ming Jow , Young Kyu Song , Jong-Hoon Lee , Xiaonan Zhang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Kenneth K. Vu; Joseph Agusta
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L49/02 ; H01L23/522 ; H01G4/33 ; H01L23/64

Abstract:
An upper planar capacitor is spaced above a lower planar capacitor by a dielectric layer. A bridged-post inter-layer connector couples the capacitances in parallel, through first posts and second posts. The first posts and second posts extend through the dielectric layer, adjacent the upper and lower planar capacitors. A first level coupler extends under the dielectric layer and couples the first posts together and to a conductor of the lower planar capacitor, and couples another conductor of the lower planar capacitor to one of the second posts. A second level coupler extends above the dielectric layer, and couples the second posts together and to a conductor of the upper planar capacitor, and couples another conductor of the upper planar capacitor to one of the first posts.
Public/Granted literature
- US20160240606A1 MULTI-LAYER INTERCONNECTED SPIRAL CAPACITOR Public/Granted day:2016-08-18
Information query
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